Importance

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Abstract

A spray coating protection method for electronic devices during metallic particle deposition via spraying is disclosed. The spray coating protection method enables selectivity over the size and location of particle deposition. The spray coating protection method is easy for an automation application, in which multiple electronic devices are processed simultaneously, and is suitable for electronic devices of different shapes and sizes. The spray coating protection method provides resistance to high temperature and high pressure during the spraying operation. The spray coating protection method utilizes masking paper, but additional film materials may be used, both to increase the protective strength of the mask and to enable easy placement and subsequent peel off of the masking paper following the spraying process. The masking paper may be made using a die cutting process and is easily placed onto the electronic device surface to ensure zero contamination from hot and high pressure spray particles.

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First Claim