METAL REMOVAL METHOD, DRY ETCHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20220325418A1
SERIAL NO

17607933

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A metal removal method which includes: a reaction step of bringing a treatment gas containing a fluorine-containing interhalogen compound and a metal-containing material containing a metal element into contact with each other to generate metal fluoride which is a reaction product of the fluorine-containing interhalogen compound and the metal element; and a volatilization step of heating the metal fluoride under an inert gas atmosphere or in a vacuum environment for volatilization. The metal element is at least one kind selected from iron, cobalt, nickel, selenium, molybdenum, rhodium, palladium, tungsten, rhenium, iridium, and platinum. Also disclosed is a dry etching method using the metal removal method and a production method for a semiconductor element using the dry etching method.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION13-9 SHIBA DAIMON 1-CHOME MINATO-KU TOKYO 105-8518

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUI, Kazuma Tokyo, JP 87 1285

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation