COOLING SYSTEMS COMPRISING PASSIVELY AND ACTIVELY EXPANDABLE VAPOR CHAMBERS FOR COOLING POWER SEMICONDUCTOR DEVICES
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United States of America Patent
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Issued Date -
Oct 27, 2022
app pub date -
Jul 8, 2022
filing date -
Jul 8, 2022
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Abstract
A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.
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