HEATING DEVICE
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United States of America Patent
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Issued Date -
Nov 3, 2022
app pub date -
Jul 14, 2022
filing date -
Jul 14, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A method for a heating device suitable for heating at least one soldered joint between an electronic component including at least a first contact mound and a printed circuit board. The soldered joint on the one hand securing the electronic component to the printed circuit board and on the other hand, while providing electrical continuity, the electronic component also having an electronic-component width, and an electronic-component thickness, wherein it includes an electrical-connection suitable for being coupled to an electrical power supply and a heater suitable for reaching a temperature at least equal to the melting point of the solder.
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