HEAT DISSIPATION MODULE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Nov 17, 2022
app pub date -
May 17, 2021
filing date -
May 17, 2021
priority date (Note) -
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Abstract
The disclosure relates to a heat dissipation module and a manufacturing method thereof. The heat dissipation module includes a heat pipe, multiple heat dissipation fins and multiple rings. The heat pipe has a peripheral wall. Each heat dissipation fin has a through hole and an annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner through the through hole. Each ring annularly is adapted to sheathe each annular wall in a compressive manner to embed and compressedly connect each annular wall to the peripheral wall. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.
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