COPPER ETCHING SOLUTION
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United States of America Patent
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Issued Date -
Dec 8, 2022
app pub date -
Apr 22, 2022
filing date -
Apr 22, 2022
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Abstract
A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
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