CAPACITOR FORMED WITH COUPLED DIES
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United States of America Patent
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Issued Date -
Dec 29, 2022
app pub date -
Jun 25, 2021
filing date -
Jun 25, 2021
priority date (Note) -
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Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques related to forming capacitors using lines in a bond pad layer within hybrid bonding techniques of two separate dies and then coupling those dies. In embodiments, these techniques may involve using dummy bond pads, where the width of these dummy bond pads are smaller than that of active bond pads, to create a pattern to serve as a capacitor structure. Other embodiments may be described and/or claimed.
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