METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MANUFACTURING MOLDED OBJECT, MOLDED OBJECT
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United States of America Patent
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Issued Date -
Jan 5, 2023
app pub date -
Nov 18, 2020
filing date -
Nov 18, 2020
priority date (Note) -
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Abstract
A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.
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