High-speed Cutting Device

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United States of America Patent

APP PUB NO 20230014163A1
SERIAL NO

17740522

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Abstract

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A high-speed cutting device includes a mounting frame, a feeding mechanism, a linear chasing-cutting mechanism, an electrode guide plate, and an acceleration driving mechanism, the acceleration driving mechanism is provided on the discharging side of the electrode guide plate, and configured to perform acceleration driving on a material tape. The acceleration driving mechanism is provided behind the linear chasing-cutting mechanism to realize the acceleration driving of the material tape.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN GEESUN INTELLIGENT TECHNOLOGY CO LTD518100 BUILDINGS 101-501 AND D BUILDING EF DEJIN INDUSTRIAL ZONE NO 40 FUYUAN 1ST ROAD ZHANCHENG COMMUNITY FUHAI STREET BAO'AN DISTRICT SHENZHEN GUANGDONG SHENZHEN CITY GUANGDONG PROVINCE 518100

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CAO, Shunnan Guangdong, CN 1 0
LI, Panpan Guangdong, CN 12 6
PANG, Wenwu Guangdong, CN 1 0
WU, Xueke Guangdong, CN 7 1
YANG, Rukun Guangdong, CN 10 9

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