METHOD AND COMPOSITION FOR ETCHING MOLYBDENUM
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United States of America Patent
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Issued Date -
Feb 2, 2023
app pub date -
Sep 21, 2022
filing date -
Sep 21, 2022
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Abstract
An etchant composition and method for etching molybdenum from a microelectronic device at an etch rate are described. A microelectronic device is contacted with an etchant composition for a time sufficient to at least partially remove the molybdenum. The etchant composition comprises at least one oxidizing agent, at least one oxidizing agent stabilizer, and at least one base and has a pH of from 7.5 to 13. The etchant composition selectively removes molybdenum at an etch rate of 5-200 Å/min.
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