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United States of America Patent
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Issued Date -
Feb 9, 2023
app pub date -
Jan 12, 2021
filing date -
Jan 12, 2021
priority date (Note) -
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Abstract
A connection terminal having a copper alloy as a base material, the copper alloy comprising Zn in an amount of 21 mass % or more and 27 mass % or less, Sn in an amount of 0.6 mass % or more and 0.9 mass % or less, Ni in an amount of 2.5 mass % or more and 3.7 mass % or less, and P in an amount of 0.01 mass % or more and 0.03 mass % or less, and the balance being Cu and inevitable impurities, wherein the copper alloy has: a 0.2% proof stress of 620 MPa or higher and 700 MPa or lower, and an electrical conductivity of 15% IACS or higher and 20% IACS or lower.
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