SILVER PASTE AND METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING BONDED ARTICLE
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United States of America Patent
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Issued Date -
Feb 23, 2023
app pub date -
Dec 18, 2020
filing date -
Dec 18, 2020
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Abstract
This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.
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