ELECTROPLATING AND ETCHING SYSTEM AND METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230059365A1
SERIAL NO

17879916

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is a system and method for electroplating and etching, which provides a solution to the problem of smoothing rough exterior features of a 3D printed or otherwise roughly manufactured object with rough exterior features. The core components of the invention are an acid bath with a first electrode and a target object as a second electrode which are in the acid bath. The first electrode and the target object are connected to a power source that causes a current to run in a first direction to etch the target object and in a second direction to plate on the target object. The amount of different metals dissolved in the acid solution will affect the composition of plated material on the target object.

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Patent Owner(s)

Patent OwnerAddress
SAPIRO DAVIDSEATTLE WA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sapiro, David Seattle, US 2 0

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