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Abstract

A copper treatment additive and methods are provided for applying copper to base metal effectively and efficiently while requiring a reduced frequency of replacing a treatment bath of copper sulfate solution. The copper treatment additive comprises an acidic, liquid mixture for use with a solution of copper sulfate and sulfuric acid to produce a strongly adherent, uniform metallic copper coating on steel. The copper treatment additive includes a first portion of Polyethylene Glycol 3350, a second portion of 4,4′-Methylene Dianiline; and a third portion of 31.45% Hydrochloric Acid. The copper coating has been observed to facilitate wire drawing processes and enhance characteristics associated with welding and decorative wire.

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First Claim