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Abstract

The photonic integrated device comprises a substrate, a plurality of mechanical resonator structures on a surface of the substrate, exposed to receive sound waves from outside the device; a plurality of sensing optical waveguides, each sensing optical waveguide at least partly mechanically coupled to at least one of the mechanical resonator structures, or a sensing optical waveguide that is at least partly mechanically coupled to all of the mechanical resonator structures; an input optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for supplying light to the plurality of sensing optical waveguides or the single sensing optical waveguide; at least one output optical waveguide on the surface of the substrate, coupled to the plurality of sensing optical waveguides or the single sensing optical waveguide, for collecting light from the plurality of sensing optical waveguides or the single sensing optical waveguide that has been affected by vibration of plurality of mechanical resonator structures.

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