HAPTIC DEVICE AND HAPTIC MODULE

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United States of America Patent

APP PUB NO 20230074323A1
SERIAL NO

17799180

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A haptic device includes: a housing; a magnetic field generation unit disposed in the housing; an elastic support unit connected to the housing; a vibration unit which is connected to the elastic support unit, and which includes an elastic material in which magnetic particles are dispersed in a matrix; and a control unit for transmitting a signal to the magnetic field generation unit.

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Patent Owner(s)

Patent OwnerAddress
CK MATERIALS LAB CO LTDSEOUL 08380

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JEE, In Sik Seoul, KR 6 2
JEONG, Cheol Sung Seoul, KR 1 2
KIM, Hyeong Jun Seoul, KR 101 307
KIM, Jeen Gi Seoul, KR 9 11

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