ELECTROFORMING MASTER, METHOD FOR PRODUCING ELECTROFORMING MASTER, AND METHOD FOR PRODUCING ELECTROFORMING MATERIAL
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United States of America Patent
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Issued Date -
Mar 23, 2023
app pub date -
Sep 9, 2022
filing date -
Sep 17, 2021
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Abstract
An electroforming master including an n-type semiconductor, and a substrate provided with a pattern on a surface thereof, in which an oxide film is formed on the surface, and a thickness of the oxide film is 18 Å or smaller, a method for producing the above-described electroforming master, and a method for producing an electroforming material using the above-described electroforming master.
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