Method for Forming Resistance on Circuit Board and Circuit Board Having Resistance
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United States of America Patent
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Issued Date -
Mar 30, 2023
app pub date -
Nov 17, 2021
filing date -
Nov 17, 2021
priority date (Note) -
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Abstract
A method for forming resistance on circuit board is provided and includes the following steps. First, a substrate is provided. Next, a second metal layer is provided on the substrate, and the first metal layer is covered by the second metal layer. Then, a resistance is formed on the second metal layer, and the resistance is directly above the first metal layer. Thereafter, the second metal layer is cut so that the edge of the second metal layer is aligned with that of the first metal layer. The second metal layer is separated from the first metal layer. Next, the second metal layer is pressed with a circuit board, and the resistance is attached to a dielectric layer of the circuit board. Then, the second metal layer is etched to form a circuit pattern on the resistance.
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