Metallic Particle-Deposition Substrate, Method and Application Thereof for Increasing Heterointerface
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United States of America Patent
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Issued Date -
Mar 30, 2023
app pub date -
May 11, 2022
filing date -
May 11, 2022
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Abstract
Present invention is related to a metallic particle-deposition substrate having a metal substrate and multiple metallic particles attached thereon. The metallic particles are nano-particles with at least 90% of these nano-particles as single layer being evenly dispersed on the metal substrate. Each of the metallic particle is isolated without toughing or overlapping. The metal substrate has different material than the metallic particles in each preferred embodiment in the present invention. More preferably, at least 80% of the metallic particles have the distance between each metallic particle is at a range of 2-6 nm for better generation of hotspot effects. The present invention provides a fast production method for producing the substrate with heterogeneous interface. The metallic particles are evenly attached to the surface of the metal substrate to obtain better surface enhanced Raman effect as to apply for sensors in all kinds of field.
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