MULTILAYER CERAMIC ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Apr 6, 2023
app pub date -
Sep 28, 2022
filing date -
Oct 4, 2021
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Abstract
A multilayer ceramic electronic component includes a multilayer ceramic electronic component main body, first and second metal terminals, an exterior material covering the multilayer ceramic electronic component main body, a portion of the first metal terminal, and a portion of the second metal terminal, and an electrostatic shielding metal embedded in the exterior material and covering at least a portion of the multilayer ceramic electronic component main body. The electrostatic shielding metal is between a surface of the exterior material and a surface of the multilayer ceramic electronic component main body, and is spaced away from the multilayer ceramic electronic component main body.
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