CHEMICAL MECHANICAL POLISHING PAD AND PREPARATION THEREOF

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United States of America Patent

APP PUB NO 20230112228A1
SERIAL NO

17500630

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.

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Patent Owner(s)

Patent OwnerAddress
DUPONT ELECTRONIC MATERIALS HOLDING INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BLOMQUIST, Robert M River Edge, US 11 30
EL-SAYED, Lyla M Boonton, US 19 179
MILLS, Michael E Bear, US 41 469
QIAN, Bainian Newark, US 54 363
REDDY, Kancharla-Arun Wilmington, US 2 1
TAYLOR, Bradley K West Chester, US 12 129
XIA, Shijing Hockessin, US 3 12

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