COOLING DEVICE AND METHOD FOR MANUFACTURING COOLING DEVICE

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United States of America Patent

APP PUB NO 20230129855A1
SERIAL NO

17938333

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Abstract

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A cooling device includes a cooling solution flow path disposed in the surroundings of a heat generating portion and formed of a metal material. The cooling solution flow path has a three-dimensional structure element having a structure in which unit elements made of the metal material are regularly aligned therein. The three-dimensional structure element is continuously provided on an inner wall surface of the cooling solution flow path.

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Patent Owner(s)

Patent OwnerAddress
HONDA MOTOR CO LTDTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIMURA, Yasunari Saitama, JP 36 219
TODAKA, Hirosumi Saitama, JP 12 2

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