ARRANGEMENT AND METHOD FOR FORMING GROOVES IN A BOARD ELEMENT
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United States of America Patent
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Issued Date -
May 18, 2023
app pub date -
Nov 15, 2022
filing date -
Nov 15, 2022
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Abstract
An arrangement for forming grooves in a board element. The arrangement includes a support member for supporting the board element during the forming and cutting elements arranged on a spindle member configured to rotate around a rotational axis. The cutting elements are configured to form the grooves by removing material from the board element. The spindle member is arranged in a pivot body configured to be pivoted with respect to the support member. The arrangement includes a driving device configured to drive the pivot body, wherein the driving device is configured to rotate in a single direction during a groove forming cycle.
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