Method for treating copper-containing waste etching solution

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United States of America Patent

PATENT NO 11939229
APP PUB NO 20230166979A1
SERIAL NO

17990441

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Abstract

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The present invention provides a method for treating a copper-containing waste etching solution, which includes: preparing basic copper chloride nanometer seed crystals and synthesizing basic copper chloride mono-crystals; making an acidic waste etching solution subjected to agglomeration reaction with an ammonium-containing solution and slurry containing the basic copper chloride mono-crystals to obtain basic copper chloride crystal particles and copper-removed waste solution; making an alkaline waste etching solution react with sulfuric acid to obtain a copper sulfate mixed solution; and then evaporating, concentrating, cooling and crystallizing the copper sulfate mixed solution obtained by the reaction of the alkaline waste etching solution and the sulfuric acid in sequence to obtain copper sulfate pentahydrate solids. In a case of low investment, the present invention not only can realize the recycling of copper in the copper-containing waste etching solution, but also can obtain various high-value products, and can achieve both environmental and economic benefits.

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Patent Owner(s)

Patent OwnerAddress
CENTRAL SOUTH UNIVERSITYNO 932 LUSHAN SOUTH ROAD YUELU DISTRICT CHANGSHA HUNAN 410083 410083

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liang, Yanjie Changsha, CN 6 6
Lin, Zhang Changsha, CN 11 1
Liu, Xueming Changsha, CN 7 0
Meng, Fandongkun Changsha, CN 1 0
Yan, Xu Changsha, CN 36 55

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