POLYAMIDE RESIN COMPOSITION, MOLDED POLYAMIDE RESIN ARTICLE, AND PRODUCTION METHOD THEREFOR
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
May 31, 2021
filing date -
Jun 9, 2020
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Abstract
A decrease in molecular weight in molding of a polyamide is suppressed. A polyamide resin composition of the present invention includes: a polyamide having a structural unit containing an alkylene group having 1 to 3 carbon atoms and an amide bond; and a compound having a cyclic structure in which first nitrogen and second nitrogen of a carbodiimide group are bonded by a bonding group. A molded polyamide resin article is produced by molding of the polyamide resin composition through heat pressurization.
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