HEAT DISSIPATING STRUCTURES
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
Dec 17, 2021
filing date -
Dec 17, 2021
priority date (Note) -
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Abstract
The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the back end of the line structure.
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