SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
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United States of America Patent
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Issued Date -
Jun 29, 2023
app pub date -
Dec 22, 2022
filing date -
Dec 28, 2021
priority date (Note) -
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Abstract
Disclosed is a method for treating a substrate, on which a plurality of reference marks and a pattern are formed. The method includes a process preparing operation, a location information acquiring operation of acquiring information on an actual location of the pattern, and a process executing operation of supplying a treatment liquid to the substrate, and heating the substrate by irradiating laser light to the pattern on the substrate, to which the treatment liquid is applied, the location information acquiring operation includes acquiring information on actual locations of, among the plurality of reference marks, at least three reference marks, and acquiring information of the actual location of the pattern through the information of the actual locations of the reference marks.
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