MUTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jun 29, 2023
app pub date -
Dec 15, 2022
filing date -
Dec 29, 2021
priority date (Note) -
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Abstract
A multilayer electronic component includes a body including dielectric layers and a plurality of internal electrodes stacked on each other in a first direction, and having a respective one of the dielectric layers interposed therebetween; a thermoelectric element disposed inside the body; and external electrodes disposed outside the body.
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