MULTILAYER ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jul 6, 2023
app pub date -
Nov 7, 2022
filing date -
Dec 31, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayer electronic component may include a cover layer disposed on a first surface of a body and extending onto a first band portion of a first external electrode and a second band portion of a second external electrode, in which the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion connected to the insulating portion and disposed on the first band portion, and a second conductive portion connected to the insulating portion and disposed on the second band portion, and the first and second conductive portions include a conductive metal and a resin.
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