ELECTRODEPOSITION WHETSTONE AND MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20230219194A1
SERIAL NO

18187325

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Abstract

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According to an embodiment, an electrodeposition whetstone includes a plating layer, first abrasive grains protruding from the plating layer, and second abrasive grains which are arranged between the first abrasive grains. The amount of protrusion of the second abrasive grains from the plating layer is smaller than the amount of protrusion of the first abrasive grains from the plating layer. A grain size of the second abrasive grains is smaller than a grain size of the first abrasive grains.

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Patent Owner(s)

Patent OwnerAddress
TOKYO DIAMOND TOOLS MFG CO LTDMEGURO-KU TOKYO 152-0031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KISHIMOTO, Jun Tokyo, JP 26 138
TSUDA, Masaaki Tokyo, JP 23 128
YAGI, Takeshi Tokyo, JP 143 1170

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