ELECTRONIC COMPONENT
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United States of America Patent
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Issued Date -
Jul 13, 2023
app pub date -
Nov 1, 2022
filing date -
Jan 11, 2022
priority date (Note) -
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Abstract
An electronic component according to an embodiment includes a multilayer capacitor, a frame terminal, and a conductive bonding portion. An area in which the conductive bonding portion contacts the frame terminal is larger than an area in which it contacts with the external electrode.
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