Multilayer chip component

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United States of America Patent

PATENT NO 11983583
APP PUB NO 20230237285A1
SERIAL NO

18130452

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In a method of manufacturing a multilayer chip component according to an aspect of the present disclosure, laser processing is used for forming dots of a two-dimensional code. This laser processing is laser processing with respect to a laminate substrate in a state before baking is performed, and an impact at the time of processing is absorbed to a certain degree due to elastic deformation of the laminate substrate. For this reason, according to the manufacturing method, occurrence of cracking can be curbed compared to laser processing with respect to an element body in a state after baking is performed.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Echigoya, Gaku Tokyo, JP 5 0
Ishida, Keijiro Tokyo, JP 5 0
Kudo, Hajime Tokyo, JP 12 58
Satou, Hiroshi Tokyo, JP 65 693

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