STEAM CLEANING OF CMP COMPONENTS
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United States of America Patent
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Issued Date -
Aug 10, 2023
app pub date -
Apr 17, 2023
filing date -
May 29, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A chemical mechanical polishing system includes a platen to support a polishing pad, a boiler, a component that is movable between a first position spaced from the polishing pad and a second position in contact with the polishing pad, a plurality of nozzles to direct steam from the boiler onto the component of the polishing system when located at the first position, an actuator to move the component from the first position to the second position in contact with the polishing pad, and a controller configured to cause the treatment station to direct the steam onto the component to clean the component, and cause the actuator to move the cleaned component from the treatment station into contact with the polishing pad.
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