THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME

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United States of America Patent

APP PUB NO 20230260698A1
SERIAL NO

18012834

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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To provide a thin film capacitor having high flexibility. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. The particle diameter of crystal at a non-roughened center part of the metal foil is less than 15 μm in the planar direction and less than 5 μm in the thickness direction. This can not only enhance the flexibility of the metal foil to reduce a short-circuit failure in a state where the thin film capacitor is incorporated in a multilayer substrate but also enhance positional accuracy.

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Patent Owner(s)

Patent OwnerAddress
TDK CORPORATIONTOKYO 103-6128

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHII, Daiki Tokyo, JP 36 60
TAKAHASHI, Tetsuhiro Tokyo, JP 21 100
YAMASHITA, Yuki Tokyo, JP 64 292
YANO, Yoshihiko Tokyo, JP 72 1754
YOSHIDA, Kenichi Tokyo, JP 202 2251

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