POLYMER BONDING PROCESS
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United States of America Patent
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Issued Date -
Sep 7, 2023
app pub date -
Mar 13, 2023
filing date -
Jun 2, 2021
priority date (Note) -
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status (Latency Note)
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Abstract
The present application provides methods and compositions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface. The application also provides kits having instructions for patching a polymer or a non-polymer substrate surface by producing a bond between a polymer patch surface and the substrate surface.
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