Importance

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Abstract

The present disclosure relates to a cooling system of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system. The cooling system includes an enclosure defining a fluid chamber, and the enclosure includes an evaporating surface configured to be in thermal communication with a liquid fluid in the fluid chamber and with an electronic component coupled to the enclosure, where the evaporating surface is configured to transfer thermal energy from the electronic component to the liquid fluid, such that the liquid fluid transitions to a vapor fluid within the fluid chamber, and includes a condensing surface configured to absorb thermal energy from the vapor fluid, such that the vapor fluid condenses into the liquid fluid within the fluid chamber. The cooling system also includes a heat rejection system coupled to an exterior surface of the enclosure, where the heat rejection system is configured to absorb thermal energy from the condensing surface.

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First Claim