Importance

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Abstract

A gettering layer forming device includes a spinner table having a surface for holding a face side of a wafer, and an annular rest surface disposed radially outwardly of the holding surface. An annular member is located on the rest surface surrounding the wafer such that a water bath is defined by the annular member and the wafer. A moving mechanism selectively places the annular member onto the rest surface and moves the annular member away from the rest surface, an abrasive grain nozzle charges free abrasive grains into the water bath, a water nozzle supplies water to the water bath to immerse the wafer in the water, an ultrasonic horn propagates ultrasonic vibrations to the free abrasive grains in the water, and a horizontally moving mechanism moves the ultrasonic horn and the holding table horizontally relative to each other in directions parallel to the holding surface.

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First Claim