CO-LOCATED MICROELECTROMECHANICAL SYSTEM MICROPHONE AND SENSOR WITH MINIMAL ACOUSTIC COUPLING
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United States of America Patent
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Issued Date -
Oct 12, 2023
app pub date -
Oct 12, 2022
filing date -
Mar 15, 2022
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Abstract
An electronic device package comprises a primary microphone having a frequency response having a first resonance frequency, and a reference microphone having a frequency response including a second resonance frequency, the primary microphone and the reference microphone configured to substantially simultaneously receive a same acoustic signal to produce a transduced signal of the primary microphone and a transduced signal of the reference microphone, the second resonance frequency of the reference microphone being different than the first resonance frequency of the primary microphone, the package having dimensions that cause the primary microphone and reference microphone to be acoustically isolated from one another at the resonance frequency of the primary microphone, there being less than 3 dB of acoustic coupling between the primary microphone and reference microphone at the first resonance frequency.
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