PRESSURE BONDING DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

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United States of America Patent

APP PUB NO 20230347638A1
SERIAL NO

18218947

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Abstract

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According to an aspect, a pressure bonding device is configured to bond, to a plate-like first workpiece having a curved surface part, a plurality of plate-like second workpieces smaller than the first workpiece. The pressure bonding device includes: a vacuum chamber; a stage disposed in the vacuum chamber and having a shape extending along a first surface of the curved surface part of the first workpiece so as to fix the first surface on the stage; and a bonding unit configured to deform an elastic diaphragm by internal pressure and pressure-bond one of the second workpieces to a second surface of the first workpiece. A plurality of the bonding units are disposed facing the stage.

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Patent Owner(s)

Patent OwnerAddress
JAPAN DISPLAY INCTOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ISHIKAWA, Makoto Tokyo, JP 200 1853
KATO, Takayuki Tokyo, JP 285 2694
TANAKA, Shinichiro Tokyo, JP 82 814

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