POLISHING LIQUID FOR POLISHING COMPOUND SEMICONDUCTOR SUBSTRATE
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United States of America Patent
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Nov 9, 2023
app pub date -
Apr 11, 2023
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May 9, 2022
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Abstract
A polishing liquid for polishing a compound semiconductor substrate includes an aqueous solution in which a permanganate and a water-soluble compound are dissolved. The water-soluble compound is obtained by combination of a strong acid and a transition metal element. The transition metal element includes at least one element of Group III elements, lanthanoid, or Group IV elements. Concentrations of ammonium ions and ammonia contained in the aqueous solution are equal to or less than concentrations of the Group III elements, the lanthanoid, and the Group IV elements.
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