A PLATINUM ALLOY COMPOSITION
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United States of America Patent
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Issued Date -
Nov 16, 2023
app pub date -
Oct 1, 2021
filing date -
Oct 1, 2021
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Abstract
A platinum alloy composition consisting, in weight percent, of: 0.0 to 10.0 gold, 0.0 to 5.0 cobalt, 0.0 to 10.0 copper, 0.0 to 7.0 iron, 0.0 to 4.0 gallium, 0.0 to 3.0 indium, 0.0 to 5.0 iridium, 0.0 to 10.0 manganese, 0.0 to 7.0 nickel, 0.0 to 15.0 palladium, 0.0 to 5.0 rhenium, 0.0 to 5.0 rhodium, 0.0 to 10.0 ruthenium, 0.0 to 3.0 tin, 85.0 or more platinum and incidental impurities, wherein two or more of gallium, indium and tin are present in an amount of 0.1 or more, wherein the following equation is satisfied in which Wco, WCu, WFe, WGa, WIn, WNi, WPd, WSn, WRh, WIr, WAu, WRu, WRe, and WMn are the weight percent of cobalt, copper, iron, gallium, indium, nickel, palladium, tin, rhodium, iridium, gold, ruthenium, rhenium, and manganese in the alloy respectively 60+WPd*2.5+WRh*3.4+WIr*6.455+WAu*11.93+WRu*13.241+WCu*14.328+WRe*16.6+WNi*16.9+WMn*18.48+WCo*18.69+WFe*21.879+WIn*29+WSn*28.207+WGa*42.379≥150 and wherein one of the following conditions is satisfied in which WCo, WCu, WFe, WGa, WIn, WNi, WPd, WSn, WMn, WRu, WIr, WRh, WAu, WPt and WRe are the weight percent of cobalt, copper, iron, gallium, indium, nickel, palladium, tin, manganese, ruthenium, iridium, rhodium, gold, platinum and rhenium in the alloy respectively −0.1028*WCo−0.1201*WCu−0.2113*WFe−0.3368*WGa−0.1125*WIn−0.1639*WNi−0.015*WPd−0.1959*WSn+17.276261−0.20*WMn+0.0678*WRu+0.035*WIr+0.045*WRh−0.059*WAu+0.066*WRe≤16.0 when WPt<95.0 and −0.1028*WCo−0.1201*WCu−0.2113*WFe−0.3368*WGa−0.1125*WIn−0.1639*WNi−0.015*WPd−0.1959*WSn+17.276261−0.20*WMn+0.0678*WRu+0.035*WIr+0.045*WRh−0.059*WAu+0.066*WRe≤16.6 when WPt≥95.0 and wherein the following equations are satisfied in which WCo, WCu, WFe, WGa, WIn, WNi, WPd, WSn, and WAu are the weight percent of cobalt, copper, iron, gallium, indium, nickel, palladium, tin, and gold in the alloy 0.35 WAu+0.6 WSn+0.6 WIn+WGa≤3.75 WCo+WPd+WFe+WNi+WCu≥1.0 WSn+WIn+WGa≥0.25.
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