PACKAGING STRUCTURE WITH MAGNETOCALORIC MATERIAL

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United States of America Patent

APP PUB NO 20230368950A1
SERIAL NO

17742153

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Abstract

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A packaging structure with a magnetocaloric material, comprising a substrate, a plurality of electrical connection structures, a die, and a sealing compound. A magnetocaloric material is added to the substrate. The die is electrically connected to the substrate through the electrical connection structures, and then encapsulated with the sealing compound. When the packaging structure is turned on, the magnetocaloric material in the substrate creates a magnetocaloric effect, which can not only take away the temperature of the packaging structure through magnetic refrigeration, but also increase the temperature difference between the packaging structure and the outside, thereby improving the efficiency of heat dissipation.

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Patent Owner(s)

Patent OwnerAddress
POTENS SEMICONDUCTOR CORP6F -3 NO 32 GAOTIE 2ND RD HSINCHU COUNTY ZHUBEI CITY 302

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Ching Kuo Zhubei City, TW 7 1
Huang, Wen Nan Zhubei City, TW 9 14
Lo, I Ming Zhubei City, TW 1 0
Meng, Hsiang Chi Zhubei City, TW 5 0
Yu, Chih Ming Zhubei City, TW 7 1

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