Wet Etching Method

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United States of America Patent

APP PUB NO 20230374669A1
SERIAL NO

18030404

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a wet etching method including pretreating a metal-containing film on a substrate with a surface modification liquid and etching the metal-containing film with an etching liquid, wherein the etching liquid is a solution containing: a β-diketone with a trifluoromethyl group bonded to a carbonyl group; and an organic solvent, wherein the metal-containing film contains a metal element capable of forming a complex with the β-diketone, wherein the surface modification liquid contains an acidic substance against the metal element, and wherein the wet etching method is carried out through: a first step of bringing the surface modification liquid into contact with the metal-containing film, thereby forming an oxide layer of the metal element at a surface of the metal-containing film; and a second step of bringing the etching liquid into contact with the metal-containing film on which the oxide layer has been formed.

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Patent Owner(s)

Patent OwnerAddress
CENTRAL GLASS COMPANY LIMITEDUBE-SHI YAMAGUCHI 755-0001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KUMON, Soichi Ube-shi, Yamaguchi, JP 45 190
NAKAMURA, Yosuke Chiyoda-ku, Tokyo, JP 64 180
OKADA, Takuya Ube-shi, Yamaguchi, JP 125 582
TANIGUCHI, Takahisa Chiyoda-ku, Tokyo, JP 18 87
WATANABE, Kenta Ube-shi, Yamaguchi, JP 80 154
YOSHIURA, Kazuki Ube-shi, Yamaguchi, JP 3 12

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