TAPE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Nov 23, 2023
app pub date -
Feb 14, 2023
filing date -
May 18, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.
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