SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Nov 30, 2023
app pub date -
May 25, 2023
filing date -
May 26, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
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