CLEANING COMPOSITION WITH MOLYBDENUM ETCHING INHIBITOR
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United States of America Patent
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Issued Date -
Dec 14, 2023
app pub date -
Jun 8, 2023
filing date -
Jun 8, 2022
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Abstract
The present disclosure relates to removal compositions for at least partially removing post-chemical mechanical polishing (post-CMP) residues from the surface of a microelectronic device. The removal compositions comprise an aqueous base composition and various molybdenum etching inhibitors that reduce the amount of molybdenum removed from the surface of the microelectronic device compared to the aqueous base composition.
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