ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230407486A1
SERIAL NO

18036313

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.

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Patent Owner(s)

Patent OwnerAddress
MEC COMPANY LTDAMAGASAKI-SHI HYOGO 660-0822

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKIYAMA, Daisaku Hyogo, JP 11 109
FUKUI, Yu Hyogo, JP 3 0
NAKANE, Dai Hyogo, JP 1 0
NISHIE, Kenji Hyogo, JP 3 0

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