METHOD FOR MANUFACTURING DIELECTRIC LAYER, RESIN COMPOSITION, AND LAMINATE COMPRISING DIELECTRIC LAYER
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United States of America Patent
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Issued Date -
Dec 28, 2023
app pub date -
Jun 9, 2023
filing date -
Jun 9, 2023
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Abstract
A manufacturing method for manufacturing a dielectric layer included in a reflective electromagnetic wave absorber, the method including the steps of: preparing a resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz; and forming a dielectric layer made from this resin composition and having a thickness of 20 to 7000 μm. A resin composition according to the present disclosure is used to form a dielectric layer included in a reflective electromagnetic wave absorber, the resin composition containing at least one dielectric compound and a resin component, and having a relative permittivity higher than 10.0 at a frequency of 3.7 GHz or 90 GHz.
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