TRANSFER PIN AND TRANSFER DEVICE
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United States of America Patent
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Issued Date -
Jan 18, 2024
app pub date -
Dec 17, 2020
filing date -
Dec 17, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
A transfer pin includes a main body portion, and a releasing portion formed on a tip end side of the main body portion, and configured to, when a solder paste including a solder ball is dipped and transferred to a mounting portion of a component of a board, release the solder paste from a tip end portion of the main body portion.
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