ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS
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United States of America Patent
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Issued Date -
Jan 18, 2024
app pub date -
Jul 17, 2023
filing date -
Jul 18, 2022
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Abstract
An electronic package comprises: a substrate; five-sided insulated electronic components, wherein each of the five-sided insulated electronic components comprises: a raw electronic component having a cuboid shape, wherein the raw electronic component has a bottom side at which the raw electronic component is mounted onto and connected with the substrate and five non-bottom sides; a conductive structure disposed on the bottom side of the raw electronic component; and an insulating layer disposed on the five non-bottom sides of the raw electronic component.
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